Philips Semiconductors Delivers USB On-The-Go Chip for Direct Connectivity
SAN JOSE, Calif.--(BUSINESS WIRE)--Jan. 21, 2002--Philips
Semiconductors, a division of Royal Philips Electronics
(NYSE:PHG - news; AEX:PHI), today announced that its Universal Serial Bus
(USB) On-The-Go (OTG) chip is available to allow flexible and cost
effective point-to-point communications between devices such as mobile
phones, digital cameras, digital video cameras, digital audio players,
printers and PDAs. This single-chip product, the ISP1362, is fully
compliant with the USB Implementers Forum's (IF) OTG Supplement to the
USB 2.0 Specification. This new USB OTG chip permits mobile devices to
communicate at times when there is no personal computer available to
act as a go-between for data exchange.
"As a core team member of the USB-IF and OTG working groups,
Philips Semiconductors is committed to providing complete USB and OTG
products," said Rajeev Mehtani, product line manager, Wired
Connectivity, Philips Semiconductors. "By leveraging our collaboration
with leading platform makers and embedded OS vendors, Philips is able
to deliver innovative OTG compliant system solutions."
As the first in a series of Philips Semiconductors' USB OTG
products, the ISP1362 offers a powerful USB architecture, based on
years of USB experience. The ISP1362 is an OTG compliant USB 2.0 host
and peripheral controller. These capabilities allow the chip to act as
USB host, USB peripheral, or both functions simultaneously. The host
and peripheral roles can be interchanged through the Host Negotiation
Protocol (HNP). The HNP feature, which allows the host function to be
transferred between two devices, eliminates the need to switch cables.
Using this feature, manufacturers of dual-role devices can determine
which peripherals its device will support.
Philips Semiconductors developed the industry's first USB OTG
prototype, which in turn was used to qualify the USB OTG supplement
leading to the supplement's public release in September 2001.
Pricing and Availability
The ISP1362 single-chip IC will sample in February 2002 with
volume production scheduled for the second quarter of 2002. Available
in the LQFP64 package, pricing for the ISP1362 is $4.90 in quantities
of 10,000. Please visit
http://www.semiconductors.philips.com/buses/usb/for additional
information.
About Philips Semiconductors
Philips Semiconductors, with revenues of US $6.3 billion in 2000,
is a world leader in silicon systems and standard products for
wireless communications, digital entertainment, computing and
automotive applications. The organization designs, develops and
manufactures silicon solutions based on its innovative Nexperia(TM)
architecture to create living technology for its customers building
products, service providers using the products, and consumers enjoying
the resulting products and services. For more information:
www.semiconductors.philips.com.
Contact:
Philips Semiconductors
Robyn Kao, 886-2-2134-2968 (Asia PAC)
Robyn.Kao@philips.com
www.semiconductors.philips.com (photos and materials)
or
Warman & Bannister
Birgit van Gellecom, 31-40-214-60-14 (Europe)
BirgitG@warban.nl
or
The Hoffman Agency
Molly Taylor, 408/975-3067 (U.S.)
mtaylor@hoffman.com
